Sigao Fanless PC, 13th Gen 24-Core i9 13900T, DDR5, PCIe 4.0 SSD, up to 64GB [B760i]

Features

• Fanless passively cooled 13th Generation 24-Core i9 Mini PC
• Intel hybrid architecture design with 8x Performance-cores and 16x Efficient-cores
• PCIe 4.0 SSD with heatpipe cooling
• Fast Low-Powered DDR5 Memory
• Extremely robust design, with 7kg of aluminium & steel
• Industrial grade internal mains power supply for intense 24/7 operation
• Embedded gaskets and seals protect the system from water spray and dust
• Second User-accessible PCIe 4.0 SSD + Optional 2 x 2.5" SSD
• Low power consumption
• Low heat generation

Description

This 13th Generation Fanless PC uses intel's hybrid architecture design with Performance-cores plus Efficient-cores, creating a fast PC suited for intense personal or business use.

We have created heatpipe cooling for the PCIe 4.0 SSD enabling the ultra fast Samsung 980/990 PRO SSD to be used intensely without thermal throttling.

A second PCIe 4.0 or 3.0 SSD is also supported, which can be accessed under the baseplate of the PC if you need to add or upgrade the SSD in the future.

The industrial grade case is manufactured in Germany and has an extremely robust design using 7kg of aluminium and steel. The embedded O-ring gaskets and silicone seals protect the inbuilt system from water spray and dust.

This model features the ASUS B760i motherboard, which uses premium components throughout for stable and reliable performance. Features include 2.5Gb LAN, Wifi 6E, Displayport 1.4, HDMI 2.1, USB 3.2 Gen 2 with USB-C, high quality audio.

The product uses a copper block on the CPU that connects to the external cooling fins using heat pipes. The motherboard's chipset is also cooled with a heatpipe. This design enables the product to not need air vents and enables it to be used in dusty/dirty environments. Because there are no moving parts and no air sucked into the case the product has zero maintenance and high reliability.

The internal industrial fanless power supply enables intense 24/7 operation and no external power adaptor is needed. The 200W rating provides plenty of capacity for the large turbo-boost requirements from the CPU. Those who need guaranteed silent operation, such as audiophiles, should choose the 400W HDPlex DC Power + external power adaptor, as it may be possible to hear some electrical noise from the industrial power supply. Worldwide mains voltages are supported, and an appropriate UK, USA, or EU mains power lead is included.

An additional 2 x 2.5" SSD or Hard Drives can be added. Please note that if you choose a hard drive, rather than SSD, you could hear some disk spinning/activity noise.

Configured to your specification

We can create a solution to meet your specific requirements. Please get in touch with the contact form, online chat, or give us a call.

If you choose the Windows installation option, as well as installing on the internal SSD drive, so it is ready to use out of the box, we also include a USB memory stick with the Windows installation, so you can rebuild or repair Windows if you need to.

You need to supply your own Monitor, Keyboard and Mouse. Please contact us if you need any recommendations or want custom additions bundled with your order.

Contents

✔ Sigao (Silver Model) Fanless B760i PC with Core i9-13900T, DDR5 memory, Samsung 980/990 PRO M.2 PCIe 4.0 NVMe SSD
✔ Mains Power lead {based on destination country}
✔ BIOS updated to latest version
✔ Memory tested with MemTest86
✔ System soak tested with Passmark BurninTest

Specifications

SSD specifications

The NVMe M.2 SSD uses the PCIe 4.0 interface to bypass the limitations of the traditional SATA interface.

Samsung 980 PRO M.2 NVMe SSD: up to 7000MB/s Sequential Read, up to 5100MB/s sequential write, up to 1000K IOPS random read/write

Processor specifications

Memory Specification

DDR5 4800Mhz 16GB (1x16GB) Memory Module

If the 32GB option is chosen the equivalent 2x16GB modules are used.
If the 64GB option is chosen the equivalent 2x32GB modules are used.  

Motherboard Technical Specification

See: Motherboard Technical Specification

Fanless Heatpipe Technology

The CPU and the motherboard chipset are cooled by using advanced heat pipes attached to both sides of the case. This technology provides efficient cooling by transferring the heat to the cooling fins on the outside. As a result you get a completely silent cooling solution that can be trusted. The cooling is so effective that the Core i9 processor can be used at 100% CPU load continually without any overheating problems.

The heatpipe cooling of the motherboard's chipset enables stable performance even under extreme loading. Cheaper fanless ITX cooling solutions rely on air cooling of the chipset which requires ventilation slots in those cases.

Case dimensions